I had the idea of repeating the cuts assuming
that the next pass would throw the swarf out of the groove.
Yes, that’s the idea. I got tired of cleaning the
John T. Johnson
PhD Candidate - Cognitive Motor Control Laboratory
Lab TA NEURO 2001 Principles
School of Biological Sciences
Georgia Institute of Technology
On 22 Mar 2019, at 8:26, John Ferguson via
I've been cutting my "grooves" in a single pass. I'm
assuming "steps" means offsets, maybe cutting a groove and
then making another pass .001 nearer the trace to clean it
up. Is that it?
I had the idea of repeating the cuts assuming that the next
pass would throw the swarf out of the groove.
If I want to do steps, I assume I would need to increase
trace separation in Eagle and then set the step in
pcbgcode. If this is approximately right, I'll go back to
the manual and try it.
my boards, except for one, are single sided with no vias.
they have a number pf dip sockets and traces must pass
between pins and there isn't a lot of space there - .010 pin
separation and I like to use the long pads; tight.
what do you think?
On 3/21/19 9:35 PM, Dan.Staver wrote:
What step size do you use and what cutter
I’ve found if I use a step of >=50% the cutter foam, I
get these “leftovers”, but, if I set a step of 30-40%, it
tends to be clean. Takes longer, of course.
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