Re: slop bucket assembly
Mike,toggle quoted messageShow quoted text
I have done it both ways - all parts and sections (IC's, resistors, capacitors). Sections is much easier for me (less likely to bump the parts around). I use a skillet and hot air to melt the paste. When I do the backside, I suspend the PCB above the skillet with a couple pennies at each corner of the PCB. When doing the backside, DO NOT TOUCH THE PCB UNTIL IT IS COMPLETELY COOLED! If you do, the parts on the other side are liable to fall off and/or move.
- 73, John, N0TA
On 9/9/2018 6:21 PM, Michael Maiorana wrote: