Re: 'Solder Rot'

Roy Thistle

On Tue, Jan 7, 2020 at 11:44 AM, DaveH52 wrote:

you will find a wealth of information, including
Thanks for that link DaveH53 (Dave?).
From the paper (buried in the long introduction) , "The purpose of this paper is to provide a better understanding of the relevance of standard strain energy based models for low cycle fatigue of solder joints in predicting the behavior of standard SMT packages subjected to a very high number of power cycles.", where the paper leads me to believe "... a very high number of power cycles." is something like 250,000.
There is also some discussion about this being a significantly higher than room temperature phenomenon.
I have definitely experienced thermally induced strain in poorly designed laptops where heat/temperatures are a problem.
While very interesting... to me at least... and I'd like to hear more...I'd venture that for a lot of the stuff discussed on this list, failures due to the phenomena, discussed in the paper, are not an issue, for many of us?
Best regards, best wishes.

Join to automatically receive all group messages.