Re: Repairability of SD-24, SD-30 & SD-32 sampling heads

Jim Ford
 

Hmmm...  Did he die-bond, wire-bond, and package the FPGA or just solder it onto the board?  Not so impressive if it's the latter.  Still, the link to the website shows microwave devices being bonded in hybrid packages to repair mixers in spectrum analyzers - now that's impressive!Jim FordSent from my Verizon, Samsung Galaxy smartphone

-------- Original message --------From: Craig Sawyers <c.sawyers@...> Date: 3/25/19 5:07 PM (GMT-08:00) To: TekScopes@groups.io Subject: Re: [TekScopes] Repairability of SD-24, SD-30 & SD-32 sampling heads He clearly knows what he is doing. You don't knock up something with an Altera FPGA unless you have a major development lab at your disposal https://www.qsl.net/ct1dmk/gw_04.jpgCraig> -----Original Message-----> From: TekScopes@groups.io [mailto:TekScopes@groups.io] On Behalf Of Jose Luu> Sent: 25 March 2019 23:29> To: TekScopes@groups.io> Subject: Re: [TekScopes] Repairability of SD-24, SD-30 & SD-32 sampling heads>> https://www.qsl.net/ct1dmk/wbond_ex.html>> This guy seem to have made a home hybrid lab and repairs. Could former professionals comment ?>> Best> Jose>>> On Mon, Mar 25, 2019 at 9:30 PM Bob Koller via Groups.Io <testtech= yahoo.com@groups.io> wrote:>> > How well I know. My last job in the hybrid business was at Teledyne> > Microelectronics. Space Qual parts had reams of paperwork, x-rays,> > PIND test,photographs, etc...> > Tek, Keysight, and many other still , out of necessity, use hybrid> > technology with custom parts, in the front ends, and other places, of> > very high frequency instruments. But, commercial hybrid production> > has, I think, largely been supplanted by ASIC, FPGA, and more modern,> > more reliable, less expensive technology.> >> >> >> >>>

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