Re: Tek 464 - Advice on soldering shielding mesh to Vertical Output IC case


 

The driver hybrid on the 7000 series vertical output amplifiers have a
pressed connection to the top of the metal can package which goes to
ground. It is held in place with a plastic clip instead of being
soldered into place. I am inclined to think Tektronix added these
because they could not rely on the ground connection through the heat
sink interface.

As far as soldering, the top of the metal can package is relatively
far from the circuits mounted to the base of the package so soldering
is relatively easy and safe assuming that the solder wets the surface.

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