Hi,

I don't think this should be of any problem. The die itself is attached to the bottom of the IC, not the to of the case where you'll solder it. If you are worried, put the IC on some cooling, such as a wet sponge.
To solder the case, first scrape or sand the top and using a lot of flux. Then melt some solder on the case and you can solder the braid. It may sound strange, but use high power (but temperature controlled) iron. This will let you solder it quickly without heating the whole IC.

Szabolcs