As I use my rig mainly in portable situations, I want to try to avoid field failures due to shocks and vibrations.
I am particularly concerned about the toroid coils and maybe the larger electrolytic capacitors.
I have my finals mounted firmly to a larger heatsink attached to the case so they will be ok.
I have some limits as to how much padding I can add as I want to use the rig /PM as well.
I have also decided to avoid the extra weight of a "Pelican" style case.
So I have three questions:
1. Are they other components I should be concerned about?
2. What method so you recommend: hot melt glue, epoxy glue, superglue or other method?
3. What about the cables, I have them bundled at the exit of the connectors wherever I could. Any other actions I should take?
Not wanting to hijack the Bitx40 thread about L2-L3.
Thanks and 73,